| PART |
Description |
Maker |
| C67076-A1001-A2 BSM181 C67076-A1016-A2 BSM181R |
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT08; Number of Contacts:15; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Right Angle Plug
SIMOPAC Module (Power module Single switch N channel Enhancement mode)
From old datasheet system
|
SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
|
| 1792D-16BT0LP 1792D-4B0LP 1792D-2B2LP 1792D-4BT4LP |
MODULE 16 OUT
MODULE 4 IN 模块4中的
MODULE 4 IN/4 OUT 模块4输入/ 4输出
MODULE 16 IN 模块16
MODULE 2 IN/2 OUT 模块2输入/ 2输出
|
NXP Semiconductors N.V.
Stackpole Electronics, Inc.
|
| HYM324000GD-60 HYM324000GD-50 |
4M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE 4M X 32 FAST PAGE DRAM MODULE, 60 ns, ZMA72
CAP 0.5PF 50V /-0.2PF THIN-FILM SN96/AG4/NI 30PPM TR-7-PA
4M x 32 Bit DRAM Module (SO-DIMM)
-4M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE
|
SIEMENS A G
SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Infineon
|
| HDPM01 |
HDPM01 module includes a pressure module and a compass module
|
Hope Microelectronics co., Ltd
|
| HYM72V8030GS-60 HYM72V8030GS-50 HYM72V8020GS-60 HY |
8M x 72 Bit ECC FPM DRAM Module buffered
8M x 72-Bit Dynamic RAM Module (ECC - Module)
8M x 72-Bit Dynamic RAM Module 8M X 72 FAST PAGE DRAM MODULE, 60 ns, DMA168
Tools, Hand Crimp; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No
|
SIEMENS[Siemens Semiconductor Group]
Infineon
SIEMENS AG
SIEMENS A G
|
| HYM324020GL-60 HYM324020GL-50 HYM324020GD-60 HYM32 |
4M x 32 -Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE
4M x 32 Bit DRAM Module (SO-DIMM)
|
Infineon
|
| HYM72V8010GS-60 HYM72V8010GS-50 HYM72V8000GS-60 HY |
8M x 72 Bit ECC FPM DRAM Module buffered
8M x 72-Bit Dynamic RAM Module (ECC - Module)
8M x 72-Bit Dynamic RAM Module 8米72位动态随机存储器模块
8M x 72-Bit Dynamic RAM Module 8M X 72 FAST PAGE DRAM MODULE, 60 ns, DMA168
Connector; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes 8M X 72 FAST PAGE DRAM MODULE, 50 ns, DMA168
|
SIEMENS[Siemens Semiconductor Group]
Infineon
SIEMENS AG
|
| EDI8C32128C WS128K32-XXX EDI8C32128LP17EI |
128Kx32 SRAM Module(低功耗CMOS12Kx32静态RAM模块（存取时5705555ns
128Kx32 SRAM Module(低功耗CMOS28Kx32静态RAM模块（存取时5705555ns
128Kx32 SRAM Module(低功耗CMOS12Kx32静态RAM模块（存取时57055555ns
128Kx32 SRAM Module(低功耗CMOS28Kx32静态RAM模块（存取时57205555ns 128Kx32 SRAM的模块（低功耗的CMOS28Kx32静态内存模块（存取时间15,17,20,25,35,45,55纳秒））
128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68
|
White Electronic Designs Corporation
TE Connectivity, Ltd.
|
| A1SJ71UC24-R2 A1SY81 A1SJ71UC24-R4 A1SNMCA-8KP A1S |
MODULE COMMS RS232
OUTPUT CARD SINK/SOURCE 32 P
MODULE COMMS RS422
MEMORY EPROM 8K GPP
INPUT CARD SINK/SOURCE 16 P
OUTPUT CARD SINK/SOURCE 16 P
MEMORY EPROM 2K
CPU MODULE 64K
通讯科的RS232模块
路RS422模块通讯
CPU MODULE 8K CPU模块8K
REMOTE I/O MODULE 远程I / O模块
|
飞思卡尔半导体(中国)有限公司
Electronic Theatre Controls, Inc.
|
| NNL10-9 NNL10 NNL10-1 NNL10-10 NNL10-11 NNL10-12 N |
Stellaris Ethernet-enabled Intelligent Display Module with PoE RDK 1-OUTPUT 10 W DC-DC REG PWR SUPPLY MODULE
ADS1675 Reference Design
TAS5631DKD2 Evaluation Module
EKT-LM3S9B90 Evaluation Kit
Single Board Computer IDM RDK
Non-Isolated DC/DC Converters
|
CANDD[C&D Technologies]
|
| VE-M4Z-CQ VE-M2Z-CQ VE-M0Z-CQ VE-MWZ-MW VE-NT2-IS |
1-OUTPUT 400 W DC-DC REG PWR SUPPLY MODULE
1-OUTPUT 100 W DC-DC REG PWR SUPPLY MODULE
1-OUTPUT 300 W DC-DC REG PWR SUPPLY MODULE
1-OUTPUT 450 W DC-DC REG PWR SUPPLY MODULE
1-OUTPUT 150 W DC-DC REG PWR SUPPLY MODULE
1-OUTPUT 75 W DC-DC REG PWR SUPPLY MODULE
1-OUTPUT 200 W DC-DC REG PWR SUPPLY MODULE
1-OUTPUT 50 W DC-DC REG PWR SUPPLY MODULE
1-OUTPUT 600 W DC-DC REG PWR SUPPLY MODULE
|
Advanced Micro Devices, Inc.
Vicor, Corp.
Noisewave, Corp.
Fairchild Semiconductor, Corp.
Moeller Electric, Corp.
|
| LKP5660-6EPD6T LKP5741-5D2T LKP5661-5D2T LKP5741-5 |
2-OUTPUT 250 W AC-DC PWR FACTOR CORR MODULE HEAT SINK, METAL, CASE K02, MODULE
2-OUTPUT 282 W AC-DC PWR FACTOR CORR MODULE
2-OUTPUT 278 W AC-DC PWR FACTOR CORR MODULE
|
Power-One, Inc.
|
